GE VMIVME-7700 350-007700-111000 H I/O board

GE VMIVME-7700 350-007700-111000 H I/O board

Technical data of product parameters

GE VMIVME-7700 350-007700-111000 H 输入 输出板To estimate overall controller power dissipation it is necessary to include the VMIVME-7700 350-007700-111000
field power component dissipated within the controller. Refer to the table
“Field Loop Power Heat Dissipation”. The field power requirements should be
calculated separately and is dependent on the number and type of field
elements. Refer to the specifications for the Digital and Analogue output
modules for details of the channel output electrical specifications.Each processor module is galvanically isolated from external power supplies
and data links so that any faults developed in the field cannot cause the module VMIVME-7700 350-007700-111000
to fail. The module will continue to operate if a failure occurs in one of its dual
redundant 24 Vdc power supplies. The module incorporates under- and overvoltage protection for its internal power supplies, which show a ‘power valid’
signal to the modules own diagnostics microprocessor.
The modules regularly initiates internal diagnostic tests which, together with a
watchdog circuit, monitor the processor performance. If the tests find a
serious fault, the processor module will shut down. A single processor system
will fail-safe. If a controller uses two or three processor modules and one
processor module develops a fault, you can fit a new processor module while
the controller is on-line without interrupting the operation of the other
processors. The new processor module automatically carries out self-education VMIVME-7700 350-007700-111000
and synchronizes with the other processors. Fault detection and fail-over in
redundant processor configurations is automatic and has no impact on
controller operationProcessor base unit supports up to three processor modules as a redundant
group. The processor base unit supplies the electrical connections between the
T9110 processor modules, and for the remaining controller modules. Each base
unit can be mounted onto standard DIN rails or directly onto a panel or wall.
The moldings use slots and clamps for DIN rail mountings, and holes for screw
fixing to flat panels.
The processor base unit holds the IP address of each processor module
separately in a BUSP component that is installed during manufacture. This
allows you to remove a faulty processor module and install a new one without
needing to set up the IP address of the replacement module

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